Smart, carefully designed optics, multi-directional lighting module produce a high quality high resolution image of PCB. Solder joint shape is represented by color allowing to distinguish a smallest surface angle variations.

Topography analysis

ALeader’s i3D technology implements advanced topography (shape) analysis – the only reliable soldering shape analysis methodology. Topography is the shape differential extracted from the 3D image. Height and volume have many variations as a result of the PCB production process whereas the differential in topography is a much more reliable method of analysis and produces more stable results.
Topography analysis highlights the differences between defects and the normal population, facilitating the identification of defects.